Item specifics
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Condition
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New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag
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Brand
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Unbranded
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Type
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Thermal Compound
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Packaging
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Blister Pack
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MPN
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Does Not Apply
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Country/Region of Manufacture
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China
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UPC
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Does not apply
Item description from the seller
- Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.05W/m.k, Thermal Resistance: <0.073°c-in2/w
- 20% metal oxide compoundsThis item is being shipped without tracking number.
Package Type – RETAIL BOX?
This item comes in brand new manufacturer retail packaging, same as what is found in a retail store. unused, unopened, undamaged item.
SHIPPING
We ship all orders the same day or next business day. Once an order is shipped, we will email you a tracking number.
We ship to all USA states including Puerto Rico, Hawaii, Alaska, APO/FPO/DPO and selected international destinations. (Please check shipping and handling tab for country specific details) Please make sure you enter the correct shipping address at the checkout.
We will not make any changes to the shipping address once you place the order
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